Search For "chip packaging"
LG Chem develops key liquid material for advanced chip packaging
Updated : 5 months, 1 week ago IST
South Korea's LG Chem Ltd. said on Monday it has developed a liquid photo-imageable dielectric (PID), a key insulating material for advanced semiconductor packaging. The company plans to actively target the artificial intelligence (AI) and high-performance semiconductor markets, according to
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LG Electronics accelerates return to semiconductor sector
Updated : 5 months, 1 week ago IST
LG Electronics is ramping up efforts to commercialize semiconductor equipment for high-bandwidth memory (HBM) as demand for chip packaging tools surges with the spread of artificial intelligence (AI), as per a report by Pulse, the English service of Maeil Business Newspaper Korea.
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LG Electronics dives into semiconductor equipment, developing HBM chip for
Updated : 7 months, 1 week ago IST
LG Electronics is making a strategic push into the semiconductor equipment sector, focusing on building key machinery for producing high-bandwidth memory (HBM) chips essential for AI applications, as reported by the Korea Herald.
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izmo Microsystems Partners with IIT Madras for Cutting-Edge Photonic Chip
Updated : 11 months, 3 weeks ago IST
Bangalore (Karnataka) [India], March 26: izmo Microsystems, a division of izmo Ltd. (NSE: IZMO) is proud to announce its role as the exclusive industry partner with IIT Madras in a groundbreaking project at the Centre for Programmable Photonic Integrated Circuits and Systems (CPPICS), Center
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