India’s semiconductor push gains momentum as Odisha signs chip te

India's semiconductor manufacturing push received another boost after Union Electronics and IT Minister Ashwini...

3D Glass Solutions to invest Rs 1,943 crore in Odisha for advance

3D Glass Solutions Inc (3DGS), USA, through its wholly owned Indian subsidiary Heterogenous Integration Packaging...

Odisha breaks ground on 3DGS advanced glass chip packaging unit,

Odisha took a major leap into the global semiconductor value chain on Sunday as Chief Minister Mohan Charan Majhi...

Union Minister Ashwini Vaishnaw calls 3DGS semiconductor plant fo

Speaking to ANI, the Union Minister highlighted Odisha's rapid industrial transformation, stating, "It is indeed...